Wafer: Difference between revisions
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File:Akbar_Mashti.JPG|Akbar Mashti ice cream with wafers | |||
File:Karlsbader-Oblate.jpg|Karlsbader Oblate | |||
File:Oplatki.w.koszyczku.jpg|Oplatki wafers in a basket | |||
File:20200106_200148Oblea.jpg|Oblea wafer | |||
File:Tunnocks-Caramel-Wafer-Split.jpg|Tunnock's Caramel Wafer | |||
File:Pirouette_cookies.JPG|Pirouette cookies | |||
File:Pink_Wafers.jpg|Pink Wafers | |||
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Latest revision as of 11:07, 18 February 2025
Wafer is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits. They serve as the substrates for microelectronic devices built in and over the wafer and undergo many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning.
History[edit]
The modern process of creating wafers started in the early 19th century with the development of the integrated circuit. The first wafers were made out of germanium, but silicon quickly became the preferred material due to its superior electrical properties.
Production[edit]
Wafer production starts with the growth of a single crystal ingot, which is then sliced into thin wafers. The wafers are then polished to a mirror finish, inspected for defects, and cleaned before they are ready for use in the fabrication of integrated circuits.
Uses[edit]
Wafers are used in the manufacture of all types of semiconductor devices, including transistors, diodes, and integrated circuits. They are also used in the production of solar cells.
See also[edit]
References[edit]
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